Highly heat and oxidation-resistant materials prepared using the silicon-containing thermosetting polymer, poly[(phenylsilylene)ethynylene-1,3-phenyleneethynylene] [-Si(Ph)(H)-CC-C6H4-CC-] are summarized. This polymer is light, moldable, soluble in solvent, and highly heat resistant. It is prepared by the dehydrogenative cross-coupling reaction of the Si-H bond of phenylsilane and the C-H bond of 1,3 diethynylbenzene in the presence of base catalysts. Applications of the polymer to particularly composite and ceramic materials are reviewed. Other polymers with molecules containing [Si(H)~CC] units are discussed. The chemistry and possible applications of the [Si(H)~CC] unit are also discussed.
http://www.benthamscience.com/open/tomsj/articles/V005/152TOMSJ.pdf
The Open Materials Science Journal, 2011, 5, 152-161
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